Semiconductor Lapping Polishing Machine (YJ2M20B-5L)

Applications:
This machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials.
Specifications:
1, Lapping plates dimensions: φ 1355mm× φ 457mm× 50mm
2, The end jumping of lower lapping plate: ≤ 0.06mm
3, Flatness of lapping plate: ≤ 0.02mm
4, Machining Capability:
25PCS/φ 75mm × 5 14PCS/φ 100mm × 5 8PCS/φ 125mm × 5
5, Carrier specifications: φ =510mm
6, Max. Diameter of work piece: φ 440mm
7, Min. Thickness of work piece: 0.5mm
8, Speed of lower lapping plate: 0~50rpm
9, Machine dimensions (L× W× H): 2432mm× 1800mm× 3082mm
10, Machine net weight: ~7000Kg
Main Features:
1, Inverter cooperates with frequency motor realize soft start, soft stop, stable speed.
2, Three motors drive the machine. Carrier speed is adjustable within an wide range.
3, Sun gear and ring gear drives by separate motors and lift at the same time. They can stop and lock themselves at any position.
4, The gate-shaped arm is convenient for plate exchanging and maintenance.
5, The using of PLC, electric proportional valve, and tension sensor realize rectilinear pressure transformation.
6, PT terminal displays all the current working data. Clients can set all the parameters by touch screen.
7, Clients can set lubrication time according to their own requirements by auto lubrication device. All the active surfaces, mesh positions, and chains can be fully lubricated. It extends the service life.